The Logitech DL precision lapping systems process materials with high geometric precision. These systems can process up to 4, 200mm/8” Ø samples （or multiple smaller samples） simultaneously.
The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
Chemicals typically used in prime face polishing of semiconductor wafers or electronic and optoelectronic crystals, such as Bromine Methanol or acid etches, are highly aggressive and require ......
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