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Logitech PM5精密研磨抛光系统是带有一个工作站的台式机，适用于科学研究水平的研磨和抛光，能够完成4英寸及以下尺寸样品的小批量处理。具有加工样品*性高、规格水平高、表面光洁等特点。 -
The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide. -
The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics -
Chemicals typically used in prime face polishing of semiconductor wafers or electronic and optoelectronic crystals, such as Bromine Methanol or acid etches, are highly aggressive and require ...... -
CMP Tribo 台式化学机械研磨抛光设备,The Tribo CMP system is a precision engineered, bench top solution designed with one thing in mind - the research of wafer processes, including their associated wafer, pad and slurry interactions. -
Logitech CP3000化学抛光设备能很好的满足腐蚀抛光溶剂，同样也适用于腐蚀性较弱的Chemlox抛光，如半导体晶片的背抛光。现在的电子器件对于晶片尺寸，表面平整度、平行度及厚度控制都有非常苛刻的控制要求，而CP3000化学抛光机，特别是跟Logitech的晶片处理系统配合使用作为Z后一个步骤时，能*达到这些控制标准。
