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The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide.
产品地址：北京市厂商性质：经销商更新时间：2026-03-31浏览次数：8656
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WSB自动粘片机简介：
The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide.
The bonding unit is designed to minimise breakage with these expensive materials, whilst retaining the highest quality of sample yield.
WSB自动粘片机特点：
• Automated process cycle
• Excellent wafer to support disc parallelism
• Process Repeatability
• 4” or 6” wafer capacity
• Single or multiple wafer bonding
Logitech WSB单元为硅和砷化镓等易碎半导体晶片的加工提供优质的键合。粘合单元的设计旨在大程度地减少这些昂贵材料的断裂，同时保持最高质量的样品产量。
自动粘片机特点：
•自动化流程循环
•出色的晶圆支持光盘平行度
•过程重复性
•4英寸或6英寸晶圆容量
•单晶圆或多晶圆键合
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