Logitech PLJ Precision Lapping Jigs are used to hold multiple “wafer geometry” or slide mounted specimens, while they are being processed on a Logitech precision lapping machine.
The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes.
The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate （e.g. glass microscope slide） for support during processing.
For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use
产品中心
我的位置：