The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
Logitech PLJ Precision Lapping Jigs are used to hold multiple “wafer geometry” or slide mounted specimens, while they are being processed on a Logitech precision lapping machine.
The NCG-2 Non-Contact Thickness Measurement Gauge is a compact and highly sensitive instrument,developed to facilitate precise dimensional measurement of fragile, soft or highly polished.
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