The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes.
The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate （e.g. glass microscope slide） for support during processing.
For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use
The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
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