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The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
产品地址：北京市厂商性质：经销商更新时间：2025-12-05浏览次数：3023
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The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm in diameter.
The APD1 will prove an effective tool in applications such as:
• cutting & wafering of crystals
• sectioning of electronic components
• dicing semiconductor components
• slotting to depth
and the cutting of a wide range of materials, such as:
• glasses
• ceramics
• rock samples
• opto-electronic materials.
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