The Logitech DL precision lapping systems process materials with high geometric precision. These systems can process up to 4, 200mm/8" Ø samples （or multiple smaller samples） simultaneously.

The Logitech DL precision lapping systems process materials with high geometric precision. These systems can process up to 4, 200mm/

8” Ø samples (or multiple smaller samples) simultaneously. The capacity range on the DL systems make these ideal for small research laboratories through to production environments.

Flexible Performance and Capabilities

The single workstation (DL1) and four workstation (DL4 ) systems are versatile machines capable of lapping samples up to 200mm / 8” Ø. The high level lapping functionality is based on Logitech’s tried and tested precision lapping and polishing jigs, allowing for a high level of geometric control whilst removing material quickly and efficiently.

The lapping carrier is motor driven which ensures consistent sample rotation during processing, resulting in excellent wafer uniformity and wafer to wafer uniformity.

Ø Flexible Abrasive Feed Systems

Ø Industry Standard Safety Features

Ø Increased Accuracy

Ø Automated Feature Set